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US Patent Issued to FUJI ELECTRIC on April 7 for "Terminal structure, method for manufacturing terminal structure, and semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,992, issued on April 7, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Terminal structure, method for manufacturing terminal st... Read More


US Patent Issued to KV Innovations on April 7 for "Three-dimensional integrated circuit" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,993, issued on April 7, was assigned to KV Innovations LLC (Albuquerque, N.M.). "Three-dimensional integrated circuit" was invented by Kamb... Read More


US Patent Issued to Wolfspeed on April 7 for "Multilayer encapsulation for humidity robustness and related fabrication methods" (North Carolina Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,994, issued on April 7, was assigned to Wolfspeed Inc. (Durham, N.C.). "Multilayer encapsulation for humidity robustness and related fabric... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Semiconductor device and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,995, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More


US Patent Issued to Intel on April 7 for "Passive circuit on a back-end-of-line of a package" (California, Oregon, Texas, Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,996, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Passive circuit on a back-end-of-line of a package" was invente... Read More


US Patent Issued to Intel on April 7 for "Inductor with integrated magnetics" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,997, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Inductor with integrated magnetics" was invented by Telesphor K... Read More


US Patent Issued to UNITED MICROELECTRONICS on April 7 for "Interposer having inductor coil pattern embedded in buffer layer and fabrication thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,998, issued on April 7, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Interposer having inductor coil pattern emb... Read More


US Patent Issued to International Business Machines on April 7 for "Multi-chip die alignment" (New York Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,999, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Multi-chip die alignment" was invented by Ef... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Non-volatile memory device including first and second monitoring channel structures and non-volatile memory system comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,000, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Non-volatile memory device including first a... Read More


US Patent Issued to Samsung Display on April 7 for "Display device including display panel and information code" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,001, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Display device including display panel and info... Read More