ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,996, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Passive circuit on a back-end-of-line of a package" was invente... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,997, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Inductor with integrated magnetics" was invented by Telesphor K... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,998, issued on April 7, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Interposer having inductor coil pattern emb... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,999, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Multi-chip die alignment" was invented by Ef... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,000, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Non-volatile memory device including first a... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,001, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Display device including display panel and info... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,002, issued on April 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Substrate-integrated waveguide" was invented by Yiqi Tang (Allen,... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,003, issued on April 7, was assigned to AaltoSemi Inc. (Nanjing City, China). "Manufacturing method of package substrate" was invented by A... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,004, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Semiconductor device with active mold package and method therefor" w... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,005, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Power electronics module" was invented by Ake Ew... Read More